ShenZhen Jieteng Circuit Co., Ltd.

Integrity Is Gold, Service Heart

Manufacturer from China
Verified Supplier
3 Years
Home / Products / Hybrid Circuit Board /

Headset Printed Circuit Board Prototype pCB Designing And Fabrication 5oz

Contact Now
ShenZhen Jieteng Circuit Co., Ltd.
Visit Website
City:shenzhen
Country/Region:china
Contact Person:MissSales Manager
Contact Now

Headset Printed Circuit Board Prototype pCB Designing And Fabrication 5oz

Ask Latest Price
Video Channel
Brand Name :JIETENG
Model Number :PCBA
Certification :ISO/TS16949/RoHS/TS16949
Place of Origin :Guangdong, China
MOQ :Negotiable
Price :Negotiable
Payment Terms :Negotiable
Supply Ability :100000 Piece/Pieces per Month
Delivery Time :5-8 days for delivery
Packaging Details :Inner vacuum packing; Outer standard carton box ,special packages requested.
Copper Thickness :1-5oz
minimum linespacing :0.075mm
minimum solder resist bridge :0.1mm
SMT Production size(Min) :50*50mm
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

PC motherboard PCB circuit board wireless Bluetooth headset circuit board production PCBA design and development

ssential details
Model Number:
PCBA-0159
Type:
pcba assembly service
Place of Origin:
Guangdong, China
Brand Name:
JIETENG
Supplier Type:
PCBA
Copper Thickness:
1-5oz
minimum linewidth:
0.075mm
minimum linespacing:
0.075mm
minimum hole diameter:
0.15mm
minimum solder resist bridge:
0.1mm
finished thickness:
0.3-3.5mm
SMT Production size(Min):
50*50mm
Mounting component Pitch:
0.15mm
Repeated accuracy:
±0.01mm
Accuracy of Printing solder paste:
±0.025mm
Certificate:
ISO9001, ISO16949, ROHS

SMT Manufacturing Capability
Item
Manufacturing Capability in process
Manufacturing Method
Production size(Min/Max)
50×50mm / 500×500mm
Production board thickness
0.2 ~ 4mm
Printing solder paste
Support method
Magnetism fixture, vacuo platform
Clamping method
Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board
Cleaning Method of printing solder paste
Dry method+ wetting method+ Vacuo method
Accuracy of printing
±0.025mm
SPI
Repeated accuracy of volume
<1% at 3σ
Mounting component
Components size
0603(Option) L75mm Connector
Pitch
0.15mm
Repeated accuracy
±0.01mm
AOI
FOV size
61×45mm
Test speed
9150mm²/Sec
3D X-ray
Shootingangle
0-45

Headset Printed Circuit Board Prototype pCB Designing And Fabrication 5oz

Inquiry Cart 0