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Mobile Phone Power Motherboard HDI circuit board multi-layer arbitrary level circuit board
Item | Mass Production |
Max Stencil Size | 1560mm*450mm |
Min SMT Package | 0201 |
Min IC Pitch | 0.3mm |
Max PCB Size | 1200mm*400mm |
Min PCB Thickness | 0.35mm |
Min Chip Size | 001005 |
Max BGA Size | 74mm*74mm |
BGA Ball Pitch | 1.0-3.00 |
BGA Ball Diameter | 0.2 - 1.0mm |
QFP Lead Pitch | 0.2mm-2.54mm |
SMT Capacity | 2 million points per day |