ShenZhen Jieteng Circuit Co., Ltd.
Integrity Is Gold, Service Heart
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High Frequency PCBs Main Board processing of medical instrument
| FR-4 Process capability | ||
| NO | Item | Craft Ability |
| 1 | Surface Finish | HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc |
| 2 | Layer | 1-24 layers |
| 3 | Min.Line Width | 4mil |
| 4 | Min.Line Space | 4mil |
| 5 | Min.Space between Pad to Pad | 3mil |
| 6 | Min.Hole Diameter | 0.20mm |
| 7 | Min.Bonding Pad Diameter | 0.20mm |
| 8 | Max.Proportion of Drilling Hole and Board Thickness | 1:10 |
| 9 | Max.Size of Finish Board | 23inch*35inch |
| 10 | Rang of Finish Board′s Thickness | 0.21-3.2mm |
| 11 | Min.Thickness of Soldermask | 10um |
| 12 | Soldermask | Green,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask |
| 13 | Min.Linewidth of Idents | 4mil |
| 14 | Min.Height of Idents | 25mil |
| 15 | Color of Silk-screen | White,Yellow,Black |
| 16 | Date File Format | Gerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++ |
| 17 | E-testing | 100%E-Test:High Voltage Testing |
| 18 | Material for PCB | High TG Material:High Frequence ROGERS,TEFLON,TADONIC,ARLON(Haloger free Material) |
| 19 | E-testing | Impedance Testing,Resisitance Testing,Microsection etc |
| 20 | Special Technological Requirement | Blind&Buried Vias and High Thickness Copper |
