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| 1 | | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
| 2 | Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
| 3 | Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| 4 | PCB Max panel size | 1100mm × 610mm |
| 5 | Layer | Mass production: 1~16 layers / Pilot run: 16 layers, Flexible PCB: 1-12 Layers |
| 6 | Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| 7 | PCBA QC | X-ray, AOI Test, Functional Test |
| 8 | Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
| 9 | Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 16 layers |
| 10 | Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
| 11 | SMT Capacity | 500Million Points/Day |
| 12 | DIP Capacity | 0.3Million Points/Day |
| 13 | Certificate | RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485 |
