FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

FR4 TG180 multilayer printed circuit board immersion gold process

FR4 TG180 is a special type of substrate material used in the manufacture of printed circuit boards (PCBs). It has a glass transition temperature (Tg) of 180°C, indicating that it can withstand high temperatures during operation without losing its mechanical or electrical properties. A multilayer PCB made with FR4 TG180 material refers to a PCB with more than two layers, usually 4 to 16 layers or more. The exact features and specifications of a multilayer FR4 TG180 PCB will depend on the manufacturer, but some common features may include:

Multilayer Count: Multilayer FR4 TG180 PCBs typically have more layers than single or two-layer PCBs, adding functionality and complexity.

High Heat Resistance: FR4 TG180 material has high heat resistance and is suitable for high temperature applications.

Tighter impedance control: Multilayer FR4 TG180 PCBs can have tighter impedance control, which is especially important for high-speed digital and RF applications.

High-frequency performance: FR4 TG180 material has good high-frequency performance and is suitable for occasions requiring high-speed signal transmission.

Smaller via sizes: Multilayer FR4 TG180 PCBs can use smaller via sizes, increasing density and reducing signal interference.

Overall, the multilayer FR4 TG180 PCB is a high performance PCB suitable for a wide range of applications where high temperature, high speed signal transmission and impedance control are important.

Shenzhen Jieteng Circuit Co., Ltd.

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