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PCB Assembly Capability | |
Item | Capability |
Advantages | ----Professional Surface-mounting and Through-hole soldering technology |
----Various sizes like 1206,0805,0603 components | |
----ICT(In Circuit Test),FCT(Functional Circuit Test) | |
----PCB Assembly With UL,CE,FCC,Rohs Approval | |
----Nitrogen gas reflow soldering technology for | |
----High Standard SMT&Solder Assembly Line | |
----High density interconnected board placement technology capacity. | |
Components | Passive Down to 0201 size |
BGA and VFBGA | |
Leadless Chip Carriers/CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mils | |
BGA Repair and Reball | |
Part Removal and Replacement | |
Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized |
Type of | Thru-hole |
Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free |
Bare Board Size | Smallest:0.25*0.25 inches |
Largest:20*20 inches | |
File Formate | Gerber files, Pick-N-Place file, Bill of Materials |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |