ShenZhen Jieteng Circuit Co., Ltd.
Integrity Is Gold, Service Heart
Add to Cart
| Item | RPCB | HDI |
| minimum linewidth/linespacing | 3MIL/3MIL(0.075mm) | 2MIL/2MIL(0.05MM) |
| minimum hole diameter | 6MIL(0.15MM) | 6MIL(0.15MM) |
| minimum solder resist opening (single-side) | 1.5MIL(0.0375MM) | 1.2MIL(0.03MM) |
| minimum solder resist bridge | 3MIL(0.075MM) | 2.2MIL(0.055MM) |
| maximum aspect Ratio (thickness/hole diameter) | 10:1 | 8:1 |
| impedance control accuracy | +/-8% | +/-8% |
| finished thickness | 0.3-3.2MM | 0.2-3.2MM |
| maximum board size | 630MM*620MM | 620MM*544MM |
| maximum finished copper thickness | 6OZ(210UM) | 2OZ(70UM) |
| minimum board thickness | 6MIL(0.15MM) | 3MIL(0.076MM) |
| maximum layer | 14层 | 12层 |
| Surface treatment | HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag | Immersion Gold,OSP,selectiveimmersion gold, carbon print |
| Min/max laser hole size | / | 3MIL / 9.8MIL |
| laser hole size tolerance | / | 10% |
