Multilayer PCB Fabrication Heavy copper plate proofing for UAV motherboard
Essential details
- Number of Layers:
-
1-8-layer
- Base Material:
-
FR4
- Copper Thickness:
-
1 Oz
- Board Thickness:
-
0.4-1.6mm
- Min. Hole Size:
-
0.10mm
- Min. Line Width:
-
0.0350mm
- Min. Line Spacing:
-
0.1mm/4mil
- Surface Finishing:
-
OSP/HASL/Lead free HASL/ENIG/Immersion Sliver
-
- Solder mask color:
-
White Black Yellow Green Red
- MOQ:
-
1piece
- Application:
-
Internet of things
- service:
-
EMS/OMD/OEM
-
| PCB Item | Manufacture Capacity |
| Layer Counts | 1--40L |
| Base Material: | FR4,High-TG FR4,Halogen free,aluminum,High Frequency(Taconic,Aron,PTFE,F4B) |
| Max board size(mm) | 1200x400mm |
| Board Thickness | 0.4mm--7mm |
| Minimum line/space | 0.075mm |
| Min Hole Size(mechanical) | 0.15mm |
| Min Hole Size(laser hole) | 0.1mm |
| Copper Weight | 0.5--6oz |
| Surface Finish | HAL,lead-free HAL,ENIG,Plated Gold,Immersion Gold,OSP |
| Solder Mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Silkscreen | White, Black, Blue,Yellow |
| Acceptable File Format | Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 |
| Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
