Mobile Power Circuit board multilayer PCB & PCBA double-sided printed circuit board
Essential details
- Place of Origin:
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Guangdong, China
- Number of Layers:
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2 Layer
- Base Material:
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FR4
- Copper Thickness:
-
1oz
- Board Thickness:
-
1.6mm
- Min. Hole Size:
-
4mil
- Min. Line Width:
-
8mil
- Min. Line Spacing:
-
8mil
- Surface Finishing:
-
HASL
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| | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc. |
| | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| | UL certificated: 6.0 OZ / Pilot run: 12OZ |
| | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| | 1150mm × 560mm |
| | 18:1 |
| | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and
Resistance control |
